Uf200 Prober Manual

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Uf200 Prober Manual

Precio™ XL

PDF Uf200 Prober Manual.pdf PDF Mcmi Iii Test Manual Millon.pdf PDF Puma 400 Doosan Manual.pdf PDF Deutz F3l912 Engine Service Manual.pdf PDF Iron Grip Home Gym Dual Station Manual.pdf PDF History Study Guide Praxis.pdf PDF Vw 19320 Constelation Manual.pdf PDF Suzuki Boulevard C109r Manual.pdf. Accretech TSK UF200SA Wafer Prober x 7 Sets Available June 2015 Main Control System. Hard Disk Drive. 3-1/2″ Floppy Disk Drive. Magneto Optical Disk Drive. Single Cassette Loaders for 25 Wafers (6- to 8-inch Wafers) Manual Wafer Inspection Transfer Unit. Dual Robotic Wafer Transport Arms. Pre-Alignment Stage Unit. Uf100-1, uf150-1, uf200-1, uf250-1, uf300-1 uf350-1 uf200-2, uf300-2, uf400-2, uf500-2, uf600-2 uf700-2 uf300-3, uf450-3, uf600-3, uf750-3, uf900-3 uf1050-3 natural gas i2h lpg propane i3p important note these instructions must be read and understood before installing, commissioning, operating or servicing equipment. Tsk Uf200 Prober Manual Vimeo and Photobucket Mislabeling Some of the items in this app were'Tsk Prober Manual Free Ebooks 27 98 230 35 bc April 23rd, 2018 - Tsk prober manual descriptions Tsk prober manual Books is good choice for you that looking. The 4090u 200mm wafer prober had a smaller installed base than its competitors, but still has loyal users contributing to some market activity. Display: 5 10 15 20 25 30 35 40 45 50 Semiconductor Test.

Precio™ XL is the latest 300mm fully automated wafer prober developed based on TEL Precio™ series. The Precio™ XL realizes high productivity, contact performance, cleanliness improvement, and short delivery time with a concept to further reduce test costs. TEL has also provided high-speed probe mark inspection TELPADS™-I and Auto Leveling (the probe card parallelism Automatic adjustment function), Users have available to them ZOOM-I which supports various Z-axis control for stable contact and soft contact, as option. The Precio™ XL wafer prober is compatible with the wafer parameters of previous Precio™ models. In addition, focusing not only on test operations but also on efficiency of setup file generation, we have introduced CoSMOz (Contact Sequence Map Optimization) software option. CoSMOz has the capability to calculate the optimum contact sequence, which was previously performed by customer test engineers. We have realized significant improvement in work efficiency and improvement in test efficiency.

List of diacritical marks

The following tools are currently being used:

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Facilities for Functional Test on Integrated Circuits

288 digital channels (256 providing up to 800Mb/s datarate, 32 providing up to 1.6Gb/s)
4.1GS arbitrary waveform generator
320MS/1GHz digitizer
1x 8 channel device power supply (max 4A/channel)
2x 4 channel device power supply (max 8A/channel)
Additional software for memory test and scan test analysis
Supports manual package test and automatic wafer test (using the UF200 wafer prober)

Accretech UF200 wafer prober

Fully automatic wafer prober for up to 25 wafers/lot
Supports 6inch and 8inch wafers
Temperature controlled chuck, -40°C up to +125°C

256 digital channels (up to 125MHz)
4-channel Agilent power analyser
1 system configured for package test, the other system configured for wafer test

Accretech UF200A wafer prober

Standard chuck (not temperature controlled)

Spectral range 7.5 . 14µm
Temperature measurement range -40°C . 1200°C
Image size 640x480


Standard lens 1.0/30 mm

image area (30 x 23)°,

Uf200 Prober Manual Download

minimum distance 300mm

Microscope objective 1,0x

Tsk Uf200 Prober Manual

image (16 x 12) mm²,

distance 50 mm, resolution 25µm
Online: up to 10 points
Offline: temperature of each pixel can be determined, additionally regions with min/max evaluation can be defined
Usage: e.g. detection of hot spots on chips (caused by shorts), thermal check of PCBs, etc